We have been providing solutions for various requirement of assembly based on newest bonding machine and precise bonding technique. Bonding CdTe detector having 100um pixel pitch and Si wafers or PCB substrate is available so far. Bonding with 100um small pixel pitch is available and corresponding with customer request, we do the process of bonding CdTe and supplied Si wafer or build suitable system. Customized imager system is also available.
Process to the hybrid module
UBM forming / bump forming
Making UBM and Bump ball on the surface of Si wafers.
Flip chip bump bonding
Hybridization by bonding CdTe detector having 100um pixel pitch and Si wafers.
Flip chip bonder
Finished
Hybrids module
Mounting of the Hybrid module
Die bonding
Assembling hybrids onto the substrates and special housings.
